SG Digital Scholarship (Undergraduate Mid-Term): 2025 Conversion Guide

Q: What does SG Digital Scholarship (Undergraduate Mid-Term): 2025 Conversion Guide cover?
A: Funding support, conversion requirements, and deployment planning for current undergraduates joining IMDA's SG Digital Scholarship mid-way through their degree.

TL;DR
The SG Digital Mid-Term Scholarship lets high-achieving undergraduates pivot into IMDA's scholarship programme, unlocking tuition support, allowances, and industry placements in exchange for a recalibrated bond aligned with remaining sponsorship.

Scholarship Snapshot

• Status: Application Cycle Closed (last checked 2025-10-05)
• Official Listing: SG Digital Scholarship (Undergraduate) Mid-Term
• Who It Targets: Singaporean university students in approved computing, engineering, or digital media degrees seeking sponsorship from Year 2 onwards
• Eligibility: Excellent university GPA, portfolio evidence of digital innovation, and strong leadership/CCA contributions demonstrating public service intent
• Tenable Institutions: NTU, NUS, SIT, SMU, SUTD, and IMDA-approved overseas universities
• Bond: Adjusted multi-year service with IMDA or partner agencies, proportionate to sponsorship duration (expect three to five years for local recipients)

Funding Package

• Reimbursement of tuition fees already incurred (subject to IMDA approval) plus full coverage for remaining semesters
• Monthly living allowance and additional support for books, devices, and approved overseas programmes
• Sponsored industry attachments or research projects aligned with national digital economy priorities
• Mentorship and leadership training, including access to SG Digital Scholar networks and bootcamps

Conversion & Development Pathway

1. Eligibility confirmation – ensure your course and specialisation remain on IMDA's priority list.
2. Application submission – provide updated transcripts, portfolio, supervisor references, and a statement on your digital impact vision.
3. Assessment centre – complete psychometrics, case challenges, and interviews covering technical depth, stakeholder engagement, and adaptability.
4. Bond negotiation – review recalibrated bond terms, deployment options, and internship placements before signing.
5. Career immersion