SP Scholarship: 2026 Profile
TL;DR
This profile summarises eligibility, what’s covered, and bond/terms-verify the latest details on the sponsor’s official page before applying.
Sponsor: Singapore PolytechnicBond: Bond-FreeOverseas: Exchange / Attachment Possible
21 Mar 2026, 00:00 Z· Last updated 30 Sep 2025
Reviewed by
Marcus Pang·Managing Director (Maths)
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Q: What does SP Scholarship: 2026 Profile cover?
A: Singapore Polytechnic's bond-free undergraduate scholarship for SP graduates heading to local autonomous universities.
TL;DR This profile summarises eligibility, what’s covered, and bond/terms-verify the latest details on the sponsor’s official page before applying.
Scholarship Snapshot
- Status: Last posted application period: 17–30 Sep 2025 (page accessed 1 Dec 2025); confirm next-cycle dates.
- Official Listing: SP Undergraduate Scholarship
- Who It Targets: SP graduates with a Diploma with Merit, strong CCA and leadership records, and no disciplinary history
- Tenable Institutions: Any of the six local autonomous universities (NUS, NTU, SMU, SUTD, SIT, SUSS)
- Bond: Bond-free
Funding & Scholar Support
- Bond-free full scholarship award of S10,000 across three academic years
