DSTA Scholarship: 2026 Profile
Download printable cheat-sheet (CC-BY 4.0)03 Oct 2025, 19:40 Z
Join our Telegram study groupQ: What does DSTA Scholarship: 2026 Profile cover?
A: Full sponsorship benefits, eligibility benchmarks, and bond obligations for the flagship DSTA Scholarship supporting engineering and digital undergraduates locally or overseas.
TL;DR\ The DSTA Scholarship funds your entire tech or engineering degree—tuition, stipends, exchanges, even postgraduate study— and launches you into the Defence Technology Community. Expect four years of bond for local routes, five to six years for overseas placements, plus internships and global exposure along the way.
Scholarship Snapshot
- Status: Applications open until 31 December 2025 (last verified 2025-10-03)
- Official Listing: DSTA Scholarship
- Who It Targets: Pre-university, polytechnic, and undergraduate students pursuing engineering, computing, mathematics, or science degrees locally or overseas
- Eligibility: Singapore Citizens with stellar academic results, strong CCA and leadership records, and a passion for defence innovation
- Tenable Institutions: Local autonomous universities and overseas universities approved by DSTA across engineering, digital, and science disciplines
- Bond: Four-year service commitment for local universities, five to six years for overseas campuses depending on study location
Award Components
Local Pathway
- Full tuition and compulsory fees from the point of award (back payments available for mid-term scholars)
- Annual allowances, book grants, and computer allowance
- Sponsorship for local exchange programmes and developmental courses
- Internship opportunities within DSTA, DSO, or CSIT, including the Global Internship Programme
Overseas Pathway
- Tuition and mandatory fees at the approved foreign university
- Overseas maintenance allowance, insurance coverage, book and computer grants
- Return economy airfare for studies and approved exchange postings
- Internship opportunities and mentorship with the Defence Technology Community throughout the bond-prep period
Eligibility Highlights
- Academic calibre: Consistent distinction-level performance in STEM subjects (A-Levels, IB, NUS High, polytechnic, or university transcripts).
- Course alignment: Majoring in disciplines such as Electrical/Electronic Engineering, Computer Science, AI & Machine Learning, Information Security, Systems Engineering, Physics, Mathematics, or related fields listed by DSTA.




